| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing silicon-embedded glass substrate excellent in shieldability in the case of used as a pressure sensor capable of surely performing electrical connection between up side and down side of the substrate through inside of the substrate and capable of easily manufacturing. SOLUTION: The method of manufacturing is composed of: the process for working a part of the silicon substrate 1 for making the protrudsion 1a; the process for inserting the protrusion 1a into the glass plate 2 by pressing the glass plate 2 onto the top of the protrusion 1a to hot press with silicon press board 3 over laid on the glass plate 2 which is heated until softening temperature; the process for cooling the glass plate 2 inserted with the protrusion 1a; and the process for removing the silicon press plate 3. COPYRIGHT: (C)2007,JPO&INPIT
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