POLISHING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE POLISHING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURED BY THE MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To hold down a change rate of a polishing speed to the polishing duration to the minimum.

SOLUTION: In this polishing method, the substrate 50 is held on a substrate holder 4, a polishing tool 10 installed opposite to the substrate holder 4 is brought into contact with the substrate 50, and the substrate holder 4 and the polishing tool 10 are relatively moved to polish the surface 51 of the substrate 50. The temperature of the substrate holder 4 is selected to polish the surface 51 of the substrate 50 in the state of keeping the temperature of the substrate holder 4 to the selected temperature according to the previously obtained data showing the relationship between the temperature of the substrate holder 4 and a change rate of polishing speed to the polishing duration.

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