| 摘要 |
<P>PROBLEM TO BE SOLVED: To electrically connect a plurality of semiconductor light emitting chips in parallel or in series. <P>SOLUTION: The light source device 1 has a plurality of patterns 6, 6a and electrodes 66, 66a that are conducted from a plurality of the patterns 6, 6a. A plurality of the patterns 6, 6a are provided on the surface 3 of an insulative substrate 2 so as to allow a common polarity of a plurality of semiconductor light emitting device chips 7 to be electrically connected. A plurality of the electrodes 66, 66a are provided so as to be conducted from the patterns 6, 6a on the backside section 4 on the reverse side of the insulative substrate 2 where a plurality of the semiconductor light emitting device chips 7 are disposed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
