| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for removing resin burrs on exposed surface, without having to provide recesses for preventing mold resin from wrapping around at the exposed surface in a heat sink. SOLUTION: This electronic equipment manufacturing method has a heat sink 10 mounted with an electronic component 20 inside a mold, sealed with a mold resin 60, and has a surface 11 of the heat sink 10 exposed from the mold resin 60. In the method, the surface 11, exposed from the mold resin 60 of the heat sink 10, is coated with a resin flush preventing material 200, the surface is sealed with the mold resin 60, and the resin flush preventing material 200 is removed from the surface 11 of the heat sink 10. COPYRIGHT: (C)2007,JPO&INPIT |
