| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for holding an object to be worked, capable of improving the adhesive power of a holding tape and a holding means. SOLUTION: In the method of holding the object to be worked in an etching device for etching the back surface of the object to be worked for which a protective tape is stuck to the surface under the atmosphere of processing gas; before etching the object to be worked, the object to be worked is sucked to the holding means and held by a vacuum suction means communicated with the holding means (S130), a pressure inside the chamber of the etching device is turned higher than the pressure inside the chamber when etching the object to be worked (S150), and the object to be worked is electrostatically absorbed by the holding means provided inside the chamber (S170). COPYRIGHT: (C)2007,JPO&INPIT |
