| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning apparatus capable of reducing damage to a semiconductor substrate wiring pattern by controlling an impulsive force due to a disruption of cavitation contributing to cleaning, and to provide a method for the ultrasonic cleaning. SOLUTION: This ultrasonic cleaning apparatus is provided to a cleaning tank 1 equipped with an inner tank 2 which stores a cleaning liquid in which a semiconductor substrate W is soaked. This apparatus is equipped with a pressure instrumentation means 6 for measuring a cleaning liquid sound pressure due to ultrasonic vibration in the cleaning liquid of the inner tank 2, and a display means for monitoring a cleaning performance and an abnormal impulsive force based on an output obtained via the pressure instrumentation means 6. COPYRIGHT: (C)2007,JPO&INPIT
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