| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for predicting a resin flow in which the flowing movement of resin with which a sealed metal die is filled, and an amount of wire deformation caused by a collision with the resin can be predicted accurately, in a semiconductor device sealed and molded by the resin. SOLUTION: A resin flow predicting apparatus includes a flow analyzer 102a for computing the flowing movement of resin within a sealed metal die, and a structure analyzer 102b for computing stress that operates upon a wire. At every fine divided time subdividing a set filling time, the flow analyzer 102a and the structure analyzer 102b perform iterative computations until the computations are settled. If the computation advanced is settled based on the fine divided time, the iterative computations are similarly performed for the next fine divided time, thereby repeating the computation processing until reaching the set filling time. COPYRIGHT: (C)2007,JPO&INPIT
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