发明名称 MOUNTING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a mounting circuit board for facilitating precise mounting of an integrated circuit package where a large number of substrate penetration lead terminals are arranged entirely on four sides of a rectangular planar body. SOLUTION: On one set of opposite sides out of rectangular four sides determined in correspondence with the arrangement of lead terminals in a mounting region on a surface, an open elongated hole 30 having the circle of a circular through-hole 20 for inserting the lead terminal as one end and the longitudinal direction intersecting the side edge of a substrate 11 perpendicularly is formed in place of the circular through-hole 20. When a package of the structure is positioned on the circuit substrate 11, end of the lead terminal inserted into the elongated hole 30 does not interfere with the substrate surface even if it is inclining from the plate surface of the package body. Since attention must be paid only to a lead terminal inserted into the circular through-hole 20 on the opposite side in the direction intersecting the elongated hole 30 perpendicularly, its operation is as easy as that in case of a package with a small number of terminals where the terminals are arranged only on one set of opposite sides of the rectangular body. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165614(A) 申请公布日期 2007.06.28
申请号 JP20050360301 申请日期 2005.12.14
申请人 SONY CORP 发明人 KIDO TOSHIHITO
分类号 H05K1/02;H05K1/18 主分类号 H05K1/02
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