CIRCUIT BOARD CONNECTING STRUCTURE, CIRCUIT BOARD CONNECTING SECTION, AND ELECTRONIC APPARATUS

摘要

A circuit board connecting structure, a circuit board connecting section, and an electronic apparatus capable of reducing the temperature difference occurring in the connecting section in performing heat pressure welding. A circuit board connecting structure (10) having a first circuit board (11) and a second circuit board (12) is subjected to heat pressure welding by being clamped with a pressing jig (20) at a first connecting section (15) and a second connecting section (16) in such a way that the first connecting section (15) and the second connecting section (16) face each other via an adhesive (13) and a first circuit pattern (17) and a second circuit pattern (18) are in contact with each other. In this circuit board connecting structure (10), the first circuit board (11) is a flexible base material (21), while a heat insulating layer (28) having a heat conduction rate lower than that of the flexible base material (21) is provided only on a portion (27) of a region corresponding to the first connecting section (15) on the back (21B) of the flexible base material (21).