发明名称 THIN-FILM LAMINATED SUBSTRATE, MANUFACTURING METHOD THEREFOR AND DISPLAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thin-film laminated substrate and the like that can suppress a conductive layer from having a step cutoff electrically causing short circuiting, the conductive layer that covers a step difference region of an insulating layer and the upper layer of the periphery of the step difference region. SOLUTION: The thin-film laminated substrate according to one embodiment is a thin-film laminated substrate, having on it an insulating layer with a step difference structure and a conductive layer formed on the insulating layer and covering at least the step difference structure, wherein the level difference structure has a forward-tapered shape, formed such that the width of the step difference region's bottom becomes progressively narrower with the increase in the distance from the substrate, and at least one kind of impurity is doped in the step difference structure of at least the insulating layer. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165774(A) 申请公布日期 2007.06.28
申请号 JP20050363380 申请日期 2005.12.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 IRIZUMI TOMOYUKI
分类号 H01L21/3205;G02F1/1343;H01L29/786 主分类号 H01L21/3205
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