发明名称 INTERGRATED CIRCUIT AND TEMPERATURE COMPENSATION CIRCUIT, AND TEMPERATURE COMPENSATED PIEZOELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an integrated circuit capable of downsizing itself comprising a plurality of elements for obtaining the predetemined circuit structure by a trimming. SOLUTION: The integrated circuit comprises a plurality of elements for constructing the plurality of element groups respectively connected to a main interconnection through trimming interconnections, and the predetermined circuitry obtained through the cutting of the trimming interconnections by laser with a unit of the element groups separated from the main interconnection. The trimming interconnection of each element is arranged within a laser spot diameter for every element group at least at the cutting part by the laser. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165672(A) 申请公布日期 2007.06.28
申请号 JP20050361387 申请日期 2005.12.15
申请人 EPSON TOYOCOM CORP 发明人 HORIE KYO
分类号 H01L21/82;H01L21/822;H01L27/04 主分类号 H01L21/82
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