| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-based composite base material for an electronic component used in a semiconductor device, particularly, in a semiconductor device such as a control unit to be mounted on an automobile, in which the adhesion between the copper-based composite base material and a resin component can be more increased, to provide an electronic component using the same, and to provide a method for producing a copper-based composite base material for the electronic component. SOLUTION: The copper-based composite base material for an electronic component is characterized in that, regarding the copper-based composite base material in which a coating layer made of tin or a tin-based alloy is formed on the surface of a copper base material or a copper alloy base material, a silicon oxide thin film comprising a hydrocarbon group and/or a hydroxyl group is formed on the surface of the coating layer. COPYRIGHT: (C)2007,JPO&INPIT |
