发明名称 Systems and methods for forming niobium and/or vanadium containing layers using atomic layer deposition
摘要 A method of forming (and an apparatus for forming) a metal containing layer on a substrate, particularly a semiconductor substrate or substrate assembly for use in manufacturing a semiconductor or memory device structure, using one or more precursor compounds that include niobium and/or vanadium and using an atomic layer deposition process including a plurality of deposition cycles.
申请公布号 US2007148932(A9) 申请公布日期 2007.06.28
申请号 US20040923315 申请日期 2004.08.20
申请人 MICRON TECHNOLOGY, INC. 发明人 DERDERIAN GARO J.;WESTMORELAND DONALD L.;UHLENBROOK STEFAN
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
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