发明名称 JOINED COPPER PARTICLES AND POWDER FOR CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To obtain copper powder for conductive paste capable of forming a coating film excellent in electrical conductivity. SOLUTION: The present invention provides jointed copper particles and powder for conductive paste composed of two or more unit particles, preferably 20 or less unit particles, joined through neck portions. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165305(A) 申请公布日期 2007.06.28
申请号 JP20060325389 申请日期 2006.12.01
申请人 DOWA HOLDINGS CO LTD 发明人 SANO KAZUJI;OKADA YOSHIHIRO;MIYOSHI HIROMASA
分类号 H01B5/00;B22F1/00;B22F9/24;H01B1/22;H05K3/12 主分类号 H01B5/00
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