SUBSTRATE FOR SEMICONDUCTOR PACKAGE

摘要

A substrate for a semiconductor package is provided to reduce the whole thickness of a semiconductor package by using gel-state adhesive instead of solder resist deposited on a portion on which a conventional chip is mounted. Circuit patterns(120) are formed on both surfaces of a core(110). Solder resist(130) is deposited on one surface of the core to cover the circuit pattern formed on one surface of the core. Gel-state adhesive(140) is deposited on the other surface of the core so that the circuit pattern formed at both side ends of the other surface of the core is exposed to the outside. The gel-state adhesive can be deposited by a screen printing method.