| 摘要 |
A package having improved reliability of a solder joint is provided to remove a defect caused by the flatness of a solder ball by increasing the height of a solder ball without increasing the pitch of the solder ball. A plurality of solder balls(102) are mounted on a substrate to be bonded to the substrate. Silicon(120) is deposited on the substrate to surround the periphery of the solder ball and a curing process is performed. The solder ball and the cured silicon are ground so that the solder ball becomes a planar solder(104) wherein another planar solder bonded to the planar solder is formed. A plurality of solder balls are re-mounted on the planar solder.
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