| 摘要 |
PROBLEM TO BE SOLVED: To highly precise and easily form a communicating hole to communicate a cavity and an external space, in a semiconductor device equipped with a semiconductor chip such as sound pressure sensor chip etc. SOLUTION: The semiconductor device includes a substrate 3 composed by laminating a plurality of insulation layer, and a semiconductor chip mounted in one end side 11a of the thickness direction of the substrate 3 having a thin film-like diaphragm which vibrates responding to pressure variation. Also, the device has a recess 13 recessed from the one end side 11a facing the diaphragm, and a communicating hole 14 to mutually communicate the recess 13 and the exterior of the substrate 3. The communicating hole 14 is formed by printing in the one pair of the insulation layer 27, 28 facing each other, and at least in one side of the facing side of the one pair of insulation layers 27, 28, at the same time, a spacer 32 is provided having a slit-shaped notch 33 extending from the periphery of the recess 13 to the end of the substrate 3. COPYRIGHT: (C)2007,JPO&INPIT |
