| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which has good flowability and continuous moldability in molding, excellent flame retardancy, and excellent solder reflow resistance and can be widely used and be produced at a low cost. SOLUTION: The epoxy resin composition for sealing a semiconductor includes an epoxy resin (A) and a phenol resin (B), wherein at least one of the epoxy resin (A) and the phenol resin (B) is represented by general formula (1), a silane coupling agent (C), a compound (D), in which hydroxy groups are each bound to 2 or more neighboring carbon atoms that compose an aromatic ring, and a metal hydroxide (E). COPYRIGHT: (C)2007,JPO&INPIT
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