Semiconductor device testing system and semiconductor device testing method

摘要

When a convex jig pushes up a bottom face of an adhesive sheet where a target semiconductor device is located, a non-target semiconductor device located near the target semiconductor device is lower in position than the target semiconductor device. Thus, the non-target semiconductor device is prevented from coming into contact with an impedance adjusting element and a coaxial connector each provided for high-frequency measurement near a socket.