Circuit arrangement e.g. control device circuit arrangement, for motor vehicle, has heat pipes for heat transfer taking place within arrangement and thermally connected with heat transport channel for heat treatment of electronic component

摘要

The arrangement (3) has a heat transfer device (4) for heating and/or cooling of an electronic component, and a heat transport channel (7) passing through a heat transport medium e.g. cool water. Heat pipes (13, 15) are provided for heat transfer that takes place within the arrangement. The heat pipes are thermally connected with the heat transport channel by its condensation area for heat treatment of the electronic component.