发明名称 A CAMERA MODULE PACKAGE
摘要 A small camera module package is provided to avoid including a member such as an additional support protection wall for protecting an image sensor and simplify a lower structure of a housing by including horizontal and vertical isolation walls inside a support casing. A lens barrel(110) with at least one lens is assembled to a housing(120) so that the lens barrel can be moved in an optical axis direction. A substrate(130) is fixed onto a lower surface of the housing and a window part(132) is formed to be opened at an end portion of the substrate which corresponds to the housing. An image sensor(140) is electrically connected to the lower surface of the housing by flip chip bonding so that an image forming area is exposed through the window part. The housing is disposed in a support casing(150), which includes an open part(151) formed through an outer surface corresponding to the lens barrel, a horizontal isolation wall(153) where lower and upper surfaces of the image sensor are contacted to each other, and a vertical isolation wall(152) where outer surfaces of the housing and the image sensor are contacted to an inner surface.
申请公布号 KR100735317(B1) 申请公布日期 2007.06.27
申请号 KR20060035605 申请日期 2006.04.20
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JANG, KUM SUNG
分类号 H04N5/225;G03B17/00;H01L27/14 主分类号 H04N5/225
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