发明名称 HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE
摘要 A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum (34) transfers chips or interposers (38) to a moving web (40) of electrical components (42) by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web.
申请公布号 KR20070067092(A) 申请公布日期 2007.06.27
申请号 KR20077006292 申请日期 2005.09.21
申请人 AVERY DENNISON CORP. 发明人 MUNN JASON
分类号 G06K19/077;G06K19/07 主分类号 G06K19/077
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