| 摘要 |
An image sensor module and a method for manufacturing the same includes a substrate 40 with an upper surface 52 and a lower surface 54. A chip 42 having a sensor region 60 is mounted on the upper surface of the substrate and an adhesive layer 46 is coated on the upper surface of the substrate. A lens holder 48 defining an internal thread 67 is adhered on to the upper surface of the substrate by the adhesive layer to encapsulate the chip, in such a way that a protection member 65 of the lens holder is located in the vicinity of the sensor region of the chip to prevent ingress of adhesive material from the adhesive layer on to the sensor region of the chip. A lens barrel 50 is screwed into the internal thread of the lens holder. |
