| 摘要 |
Provided is an epoxy resin composition for the package of a semiconductor device which does not generate harmful compounds in case of incineration, does not corrode a semiconductor chip or a lead frame, and shows excellent flame retardancy and molding property. The epoxy resin composition comprises a melamine modified derivative represented by the chemical formula 1 and zinc borate represented by 2ZnO.3B2O3.3.5H2O as a flame retardant in an amount of 0.5-8 wt%, wherein R1 to R3 are identical to or different from one another and are a C1-C10 alkyl group or a primary amine group. Preferably, the epoxy resin composition comprises a polyaromatic epoxy resin represented by the chemical formula 3; and a polyaromatic phenol resin curing agent represented by the chemical formula 4, wherein the average of n is 1-7.
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