发明名称 FUNCTION ELEMENT MOUNTING MODULE AND MANUFACTURING METHOD THEREOF
摘要 The present disclosure provides an optical functional device-mounted module which needs no expensive or special members, can be reduced in size, and provide a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.
申请公布号 EP1801888(A1) 申请公布日期 2007.06.27
申请号 EP20050780930 申请日期 2005.08.25
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 YONEDA, Y.;ASADA, T.
分类号 H01L31/02;H01L21/56;H01L23/28;H01S5/022 主分类号 H01L31/02
代理机构 代理人
主权项
地址