| 摘要 |
<p>Provided are a highly-adhesive polyimide film, which has an improved adhesiveness with a copper foil and is superior in dimensional stability and water wettability, and a manufacturing method thereof, which produces the highly-adhesive polyimide film efficiently. The highly-adhesive polyimide film is formed by using 12-30mol% of para-phenylenediamine and 70-88mol% of 4,4'-diaminodiphenylether as diamine components and 50-99.5mol% of pyromellitic acid and 0.5-50mol% of 3,3',4,4'-biphenyltetracarbonic dianhydride as acid components. The polyimide film has a surface free energy of 80mN/m or more measured by a contact angle method.</p> |
