| 发明名称 |
Thick film capacitors on ceramic interconnect substrates |
| 摘要 |
<p>Thick-film capacitors are formed on ceramic interconnect substrates having high capacitance densities and other desirable electrical and physical properties. The capacitor dielectrics are fired at high temperatures.
</p> |
| 申请公布号 |
EP1801826(A1) |
申请公布日期 |
2007.06.27 |
| 申请号 |
EP20060026011 |
申请日期 |
2006.12.15 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
AMEY, DANIEL IRWIN;BORLAND, WILLIAM J. |
| 分类号 |
H01G4/33;H01G4/12;H01G13/00;H01L23/12;H05K1/09;H05K1/16;H05K3/46 |
主分类号 |
H01G4/33 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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