| 摘要 |
<p>Provided is a highly-adhesive polyimide film, which has an improved adhesiveness with a copper foil, is superior in dimensional stability and water wettability, and is efficiently manufactured. A polyimide film is formed by using 20-40mol% of p-phenylenediamine and 80-60mol% of 4,4'-diaminodiphenylether as diamine components and 100mol% of pyromellitic dianhydride as an acid component. The manufacturing method of highly-adhesive polyimide film consists of plasma-treating the surface of the polyimide film, wherein the surface of the polyimide film is continuously plasma-treated in a treatment strength of 500w.min/m^2 or more by high voltage. The high voltage is applied to a space between a high voltage application electrode and a support electrode under an atmosphere of 100-1000Torr containing at least 20mol% or more of a rare gas, wherein the high voltage application electrode of which the surface is coated with a dielectric material, is cooled to 10-100°C, and the support electrode of which a discharge-forming surface is coated with a dielectric material, is installed opposite to the high voltage application electrode and supports the polyimide film.</p> |
