| 摘要 |
A carrier structure using a hydroforming method is provided to reduce vibration noise by attaching a bottom part of a cooling module on a reception hole formed on a supporting frame. A carrier structure using a hydroforming method includes a supporting frame(22), a curved surface(23), and an upper frame(21). The supporting frame is obtained by forming an aluminium pipe in a shape of U using a hydroforming technology. The curved surface is formed on a portion bent similar to a bottom edge of the supporting frame. The upper frame is coupled to a top of the supporting frame by a screw connection through a connection hole. The upper frame is manufactured with an aluminium to reduce a weight itself. A cooling module is installed on a lower part of the upper frame without adding a special bracket.
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