发明名称 LEQUID PROCESSING APPARATUS
摘要 A chemical processing apparatus is provided to embody a compact chemical processing apparatus by controlling an increase of the size of the whole chemical processing apparatus as compared with a conventional chemical processing apparatus which is simply enlarged according to a large-area substrate. A chemical processing apparatus supplies chemicals to a substrate to perform a chemical process. The substrate is retained by a retaining unit. A loading/unloading holes for loading/unloading the retaining unit is formed in a process chamber(51). The retaining unit is received in the process chamber to perform a predetermined chemical process on the retained substrate in the retaining unit. While the retaining unit is received in the process chamber, the loading/unloading holes formed in the process chamber are closed by a lid part. The retaining unit is rotated by a rotation unit. The retaining unit, the rotation unit and the lid part are built in one structure. While the retaining unit retains the substrate almost vertically, the retaining unit can be received in the process chamber.
申请公布号 KR20070067057(A) 申请公布日期 2007.06.27
申请号 KR20070056885 申请日期 2007.06.11
申请人 TOKYO ELECTRON LIMITED 发明人 KAMIKAWA YUJI
分类号 H01L21/304;H01L21/00;H01L21/673;H01L21/677 主分类号 H01L21/304
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