| 摘要 |
A method for manufacturing a multi-layered ceramic electronic component includes positioning a multi-layered unit including a release layer, an electrode layer and a ceramic green sheet formed on a support sheet in such a manner that the surface of the multi-layered unit is located on a base substrate and a step of pressing the multi-layered unit toward the base substrate, thereby laminating the multi-layered unit on the base substrate, and employs as the base substrate a base substrate having such surface roughness as to include per 0.01 mm<SUP>2 </SUP>thereof not more than one protrusion that can penetrate the ceramic green sheet of the multi-layered unit laminated on the base substrate to half or more the thickness of the ceramic green sheet and include per 100 mm<SUP>2 </SUP>thereof not more than one protrusion that can completely penetrate the ceramic green sheet. |
