METHOD OF CONTROLLING CONTACT LOAD IN ELECTRONIC COMPONENT MOUNTING APPARATUS

摘要

A method of controlling contact load in an apparatus for mounting electronic components on a substrate includes a head holding an electronic component being lowered at a first speed to a first position where the electronic component does not contact the substrate. The head is lowered at a second speed slower than the first speed from the first position until a predetermined target contact load is detected. The head is moved down by a small step for a predetermined distance at the second speed and a contact load is measured after moving the head down. The method includes determining whether a measured contact load has reached the predetermined target contact load. The moving and the measuring is sequentially repeated until the measured contact load reaches the predetermined target contact load. The predetermined distance is set to a first predetermined distance when moving the head down until the electronic component contacts the substrate. The predetermined distance is set to a second predetermined distance when moving the head down after the electronic component contacts the substrate and the second predetermined distance is smaller than the first predetermined distance.