ELECTRIC SOURCE SUPPLIER WITH SUBSTRATE HAVING DUAL HEAT TRANSFER STRUCTURE

摘要

A power supplier having a dual heat dissipation structure is provided to radiate the heat generated from a board by integrally connecting a fastening member of the power supplied with a chassis. A power supplier includes a substrate fixing heat sink for conducting heat of components mounted on a substrate outwardly. The power supplier is interposed between a substrate fixing base plate(50) and a substrate fixing front plate(60) having a predetermined area. The power supplier is engaged to a chassis and a socket through a fastening member(30) and a connecting pin. The fastening member is integrally connected to the chassis, so that heat generated from components of the power supplier is conducted through the base plate and front plate.