发明名称 |
Integrated circuit devices, edge seals therefor |
摘要 |
An edge seal for a chip with integrated circuits. A first metal line extends along a periphery of the chip, with a first inter-metal dielectric layer on the first metal line. A second metal line overlies the first inter-metal dielectric layer and extends along the periphery of the chip. A plurality of first metal plugs in the first inter-metal dielectric layer connects the first metal line and the second metal line and at least one first metal wall in the first inter-metal dielectric layer is laterally adjacent to a periphery of the first metal line.
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申请公布号 |
US7235864(B2) |
申请公布日期 |
2007.06.26 |
申请号 |
US20040002098 |
申请日期 |
2004.12.03 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LEE TZE-LIANG |
分类号 |
H01L23/544;H01L21/78;H01L23/04;H01L23/58 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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