| 摘要 |
The present invention is directed to a multi-layer interconnection circuit module in which plural unit wiring layers are interlayer-connected to each other through a large number of via holes so that they are laminated and formed, wherein respective unit wiring layers ( 8 ) to ( 12 ) are adapted so that photo-lithographic processing is implemented to a first insulating layer ( 22 ) formed by photosensitive insulating resin material to form via hole grooves ( 25 ), and photo-lithographic processing is implemented to a second insulating layer ( 23 ) formed by photosensitive insulating resin material on the first insulating layer ( 22 ) to form wiring grooves ( 27 ). A conductive metal layer ( 24 ) is formed on the second insulating layer ( 23 ) in such a manner that conductive metal is filled within the via hole grooves ( 25 ) and the wiring grooves ( 27 ) to implement polishing processing to the conductive metal layer ( 24 ) until the principal surface of the second insulating layer ( 23 ) is exposed to form via holes ( 13 ) and wiring patterns ( 26 ) by the conductive metal filled within the via hole grooves ( 25 ) and the wiring grooves ( 27 ).
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