| 摘要 |
An electrostatic chuck apparatus for manufacturing a semiconductor device is provided to secure the complete falling of a lift pin and to prevent vibration of a wafer and the leakage of helium gas by using a bearing between a lower connection shaft and a lower movement hole. A plurality of lift pins(24) are provided on a lower electrode(30) to be elevated on order to place and release a wafer(W). The lift pin is made of an upper connection shaft(24a), a self-weight body(24b), and a lower connection shaft(24c), which are integrated on one body. An upper portion of the self-weight body is located in an upper movement hole(32) formed in the lower electrode while a lower portion thereof is formed in a lower movement hole(34) formed at a lower of the upper movement hole. A bearing(B) is arranged between the lower connection shaft and the lower movement hole to close a gap therebetween such that a foreign material is not accumulated at the gap to allow the lower connection shaft to completely move downwardly.
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