MULTILAYER PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF

摘要

A multilayer printed circuit board and a method for manufacturing the same are provided to control a height of a conductive bump by adjusting a thickness of a copper foil when forming the copper foil. A method for manufacturing a multilayer printed circuit board includes the steps of: forming a first laminated plate(A) and a second laminated plate(B) having circuit patterns on upper and lower surfaces of a first insulating layer, a via hole which penetrates the first insulating layer and the circuit patterns to electrically connect the circuit patterns, and a conductive paste filled in the via hole; forming an interlayer connection layer(C) having a via hole in a second insulating layer, and a conductive paste filled in the via hole to be protruded from upper and lower surfaces of the second insulating layer; and thermally compressing the first laminated plate(A), the second laminated plate(B), and the interlayer connection plate(C) interposed between the first laminated plate(A) and the second laminated plate(B) whose via holes are located on the same line.