发明名称 ARTICLE, METHOD, AND APPARATUS FOR ELECTROCHEMICAL FABRICATION
摘要 An electroplating method that includes: a) contacting a first substrate (2) with a first electroplating article (4), which includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from an electroplating bath (58) which is a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. The method may be used in the microfabrication of miniaturized devices. Electroplating articles and electroplating apparatus a re also disclosed.
申请公布号 CA2286326(C) 申请公布日期 2007.06.26
申请号 CA19982286326 申请日期 1998.04.03
申请人 UNIVERSITY OF SOUTHERN CALIFORNIA 发明人 COHEN, ADAM L.
分类号 B81C1/00;C25D5/02;B21C37/00;C23F1/00;C25D;C25D1/00;C25D1/10;C25D5/10;C25D7/12;C25D17/06;C25D19/00;C25D21/12;H01L21/288;H05K3/24 主分类号 B81C1/00
代理机构 代理人
主权项
地址