| 摘要 |
A method for quantitatively analyzing the surface roughness by using an optical microscope is provided to quantitatively evaluate the surface roughness by using the optical microscope after an etching process. A method for quantitatively analyzing the surface roughness after an etching process in a silicon wafer manufacturing process includes the steps of measuring an image of a surface of the silicon wafer with an optical microscope(210), measuring a cross-section curve of a gray tone level according to a pixel by using a common image program in the measured image(220), performing leveling with a residual difference with respect to a minimum square average line by calculating a reference line in which the square value of the displacements is minimized, quantitatively analyzing the surface roughness by quantitatively calculating the leveled profile with parameters.
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