| 摘要 |
A semiconductor device is provided to sufficiently transfer the heat generated from a semiconductor device to a heat spreader by effectively controlling the flow of a heat conductive material(solder alloy, for example) from the surface of a heat spreader wherein the heat generated from the semiconductor device is transferred to the heat spreader by the heat conductive material. A semiconductor device(1) is mounted on one main surface of a substrate. A plurality of passive devices(8) are mounted on the periphery of the semiconductor device. A heat spreader(20) is mounted on the substrate, connected to the back surface(5) of the semiconductor device by a heat conductive material. The surface roughness on the surface of the heat spreader in contact with the heat conductive material is not uniform on the entire surface. The heat conductive material can be solder alloy. |
