| 摘要 |
An apparatus for polishing a silicon wafer is provided to overcome a decrease of the flatness in the final polishing step by improving only the retaining assembly used as consumables without varying the structure of a wafer polishing apparatus. A backing film(52) supports a wafer, attached to the lower part of a polishing head. A retainer ring(28) is disposed on the backing film, having an inner diameter of the diameter of a wafer plus alpha. When the backing film surrounded by the retainer ring has the same thickness, the edge part(52a) of the backing film close to the retainer ring is made of a relatively soft material. The edge part can have a width of 3~5 mm in the inner radial direction from the inner wall of the retainer ring.
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