SEMICONDUCTOR CHIP, FILM SUBSTRATE AND SEMICONDUCTOR CHIP PACKAGE USING THE CHIP AND THE FILM SUBSTRATE

摘要

A semiconductor chip is provided to embody a semiconductor chip with high integration and a semiconductor chip package using the same by decreasing the area of an interconnection for supplying power. A semiconductor chip includes a plurality of input pads(210a,210ab,210b) and a plurality of output pads(230). The input pads include a plurality of successive first input pads and a second input pad for supplying power to the semiconductor chip. The second input pad is separated from the first input pads by interposing at least one output pad. The second input pad and the first input pads can be disposed at mutually confronting edges of the semiconductor chip.