| 摘要 |
Provided is a heat-resistant masking tape suitable for electronics applications comprising a polyetherimide polymer film having a first surface and a second surface, an adhesive on the first surface, and a low adhesion agent on the second surface, wherein at least one of the polyetherimide film, the low adhesion agent and the adhesive includes micronized carbon black. Also provided is a process for making this tape and electronic circuits using this tape. |
