发明名称 PULP MOLD FOR PACKING AN ELECTRONIC APPLIANCE
摘要 A pulp mold for buffering and packing an electronic product is provided to safely protect the electronic product by forming stack support ribs at the outer lower side in which the electronic product is not contacted with the hard stack support ribs. In the pulp mold(10) for buffering and packing an electronic product(1), a portion of one side of the electronic product is fitted to a recessed fitting groove unit(11). The fitting groove unit is formed through a plurality of buffer support ribs(12) separately arranged along the lateral side. Stack support ribs(14') are integrally formed to prevent the pulp molds from being excessively fitted in stacking the pulp molds. The stack support ribs are formed protrudently on the outer lower side in which the electronic product is impossible to contact with the stack support ribs.
申请公布号 KR20070064814(A) 申请公布日期 2007.06.22
申请号 KR20050125325 申请日期 2005.12.19
申请人 DAEWOO ELECTRONICS CORPORATION 发明人 SHIN, MYOUNG HO
分类号 B65D81/02 主分类号 B65D81/02
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