| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-reliability molded semiconductor device and a manufacturing method for such a semiconductor device. <P>SOLUTION: The method reduces any mismatching in the thermal expansion coefficients among module components for a semiconductor element by giving the anisotropy to the thermal expansion coefficient of a molding resin for a molded semiconductor device. In fact, the molded semiconductor device is structured in such a way that a thermal expansion coefficient in a direction parallel to an insulated substrate side of the molding resin may be different from that in a direction perpendicular to an insulated substrate side. <P>COPYRIGHT: (C)2007,JPO&INPIT |
