| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic/package of which reduction of the area of a sealing electrode as well as occurrence of rough on the surface of the sealing electrode are suppressed compared with a conventional technology, even if reduced in size and weight for improved air-tight sealing property of electronic circuit components housed in a cavity. <P>SOLUTION: A ceramic/package comprises a cavity for housing electronic circuit components, with a plurality of ceramic layers being laminated. On the surface of any one of ceramic layers, a sealing electrode is formed from a conductive material which air-tight seals the electronic circuit components by bonding a cap. A cavity inside wall conductive layer of conductive material is formed at least at a part of the cavity inside wall of the ceramic layer where the sealing electrode is formed. The sealing electrode is grounded through the cavity inside wall conductive layer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
