发明名称 THROUGH-HOLE FORMING METHOD FOR FERRITE PLATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide the through-hole forming method of a ferrite plate, for forming a small diameter through-hole with a large aspect ratio, surely removing dross in a short period of time, and also reducing manufacturing cost. <P>SOLUTION: In this through-hole forming method: a ferrite plate 1 is fixed to a positioning tool 5; the original point of the X axis and Y axis is determined from the position of a reference through-hole 4 bored in the positioning tool 5; and the position of the through-hole 10 that is to be formed on the ferrite plate 1 is determined. Then, the ferrite plate 1 is irradiated with a CO<SB>2</SB>laser beam 9 via a lens 7 and a high-speed galvano mirror 8 to form the through hole 10 on the ferrite plate 1. Subsequently, dross 21 formed around the through-hole 10 is removed by sand blast 11. By performing cycle machining in which the CO<SB>2</SB>laser beam 9 is emitted a plurality of times, the through-hole with a small diameter and high accuracy can be efficiently formed. In addition, by removing the dross 21, joining reliability can be enhanced between an electrically conductive film of a coil or the like to be formed thereafter and the ferrite plate 1. Further, since a photo-lithography process is dispensed with, the manufacturing cost can be reduced. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007152374(A) 申请公布日期 2007.06.21
申请号 JP20050348604 申请日期 2005.12.02
申请人 FUJI ELECTRIC DEVICE TECHNOLOGY CO LTD 发明人 KINO HIDEKI;MACHIDA HIROSHI
分类号 B23K26/38;B23K26/02;B23K26/067;B23K26/16;B23K26/40;H01F17/00;H01F27/255 主分类号 B23K26/38
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