| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a deformation of a lead frame having a step between a head part and a lead part. <P>SOLUTION: A mount part 4 comprising the head part 2 for mounting a semiconductor chip 11 and the lead part 3 for connecting the lead wire 12 is arranged in matrix, the mount part 4 is supported to a frame 5 by a supporting part 6 extending from the part 3, and concurrently, a coupling part 7 for coupling a plurality of heads 2 on the lead frame 1 with the step 3d provided between the part 2 and the part 3 is provided. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
