| 摘要 |
PROBLEM TO BE SOLVED: To provide the surface planarizing method of a thin film for improving planarity while suppressing any damage on a thin film surface. SOLUTION: When a plurality of thin films are laminated, plasma treatment is carried to a previously formed thin film surface for planarization, and the next thin film is formed on the thin film surface. The plasma treatment is carried out by using a high pressure and low energy plasma for preventing the removal of atoms configuring the thin film surface. COPYRIGHT: (C)2007,JPO&INPIT
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