| 摘要 |
An integrated circuit chip includes devices formed by doping of a semiconductor on a substrate and at least one post-device formation through-chip via made up of an annulus of insulating material, an annulus of metallization bounding an outer surface of the annulus of insulating material and an annulus of electrically-conductive material within the annulus of insulating material, the annulus of metallization and the annulus of electrically-conductive material being electrically isolated from each another.
|
